[IEEE] Copper Residue Removal from Electrostatic Chuck to Mitigate Helium Leak Faults Using Enhanced In-Situ Chamber Clean : EO: Equipment Optimization

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期刊：2025 36th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

文献作者：Rajkumar Thiruchelvam; Benedict Cheong; Woei Hau Wong

出版日期：2025-5-5

DOI号：10.1109/asmc64512.2025.11010796

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11010796

文献链接：https://doi.org/10.1109/asmc64512.2025.11010796

当前文献来源于 IEEE。

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