[IEEE] A Fan-Out Panel Level Packaging (FOPLP) Structure Achieving Double-Sided Die Bonding Interconnects Through Copper Through-mold Vias (TMVs)

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期刊：2025 26th International Conference on Electronic Packaging Technology (ICEPT)

文献作者：Jianfang Zhu; Shikang Liu; Dongdong Shao; Kunpeng Ding

出版日期：2025-8-5

DOI号：10.1109/icept67137.2025.11157244

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11157244

文献链接：https://doi.org/10.1109/icept67137.2025.11157244

当前文献来源于 IEEE。

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