Multi-scale Finite Element Simulation of 2.5D Advanced Packaging for Integrated Circuits during Manufacturing Process

发表于 2026-8-6 15:25:25

期刊：2024 25th International Conference on Electronic Packaging Technology (ICEPT)

文献作者：Wenqian Li; Ruiqian Zheng; Nan Sheng; Xiaohui Zhao; Wen Qiao; Mengxuan Cheng; Zhiyan Zhao; Yuxi Jia

出版日期：2024-8-7

DOI号：10.1109/icept63120.2024.10668426

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10668426

文献链接：https://doi.org/10.1109/icept63120.2024.10668426

当前文献来源于 IEEE。

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[IEEE] Multi-scale Finite Element Simulation of 2.5D Advanced Packaging for Integrated Circuits during Manufacturing Process

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