A Novel Chip Surface Shielding Structure for Promoting Insulation Capability of High Voltage Semiconductor Chip

发表于 2026-8-6 21:38:28

期刊：IEEE Transactions on Electron Devices

文献作者：ZhaoCheng Liu; Xiang Cui; XueBao Li; ZhiBin Zhao; XiangChen Liu; Rui Jin; XinLing Tang; Feng He

出版日期：2022-1-

DOI号：10.1109/ted.2021.3130851

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9632696

文献链接：https://doi.org/10.1109/ted.2021.3130851

当前文献来源于 Institute of Electrical and Electronics Engineers (IEEE)。

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[IEEE] A Novel Chip Surface Shielding Structure for Promoting Insulation Capability of High Voltage Semiconductor Chip

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