Experimental Studies of High Frequency Performances of Plated Through Hole and Coaxial Via in Printed Circuit Boards Up to 110 GHz

发表于 6 天前

期刊：2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

文献作者：Chien-Chang Huang; Pin-Xian Liu; Yu-Chen Liu

出版日期：2024-5-20

DOI号：10.23919/emcjapan/apemcokinaw58965.2024.10585037

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10585037

文献链接：https://doi.org/10.23919/emcjapan/apemcokinaw58965.2024.10585037

当前文献来源于 IEEE。

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[IEEE] Experimental Studies of High Frequency Performances of Plated Through Hole and Coaxial Via in Printed Circuit Boards Up to 110 GHz

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