Chip Variability Mitigation through Continuous Diffusion Enabled by EUV and Self-Aligned Gate Contact

发表于 6 天前

期刊：2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

文献作者：Stephane Badel; Miao Xu; Xiaolong Ma; Wen Yang; Wei Zheng; Xiangqiang Zhang; Meng Lin; Yong Yu; Wei Wei; Qiuling Zeng; Zanfeng Chen; Xiaowei Zou; Waisum Wong; Yanxiang Liu; Sunhom Steve Paak; Yu Xia

出版日期：2018-10-

DOI号：10.1109/icsict.2018.8565694

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=8565694

文献链接：https://doi.org/10.1109/icsict.2018.8565694

当前文献来源于 IEEE。

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[IEEE] Chip Variability Mitigation through Continuous Diffusion Enabled by EUV and Self-Aligned Gate Contact

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