The process development and reliability study of low cost Area Array QFN packaging technology

发表于 2026-8-18 10:52:36

期刊：2014 15th International Conference on Electronic Packaging Technology

文献作者：Hu Wang; Taotao Li; Xiaobo Ma; Xiaolong Wang; Shiguang Chen; Jianyou Xie; Daquan Yu

出版日期：2014-5-

DOI号：10.1109/icept.2014.6922612

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=6922612

文献链接：https://doi.org/10.1109/icept.2014.6922612

当前文献来源于 IEEE。

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