Process Design Kit and Initial Demonstration of Digital Metal-Embedded Chip Assembly for High Density IO Fan-Out Packaging

发表于 2026-8-27 17:20:19

期刊：2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

文献作者：Souheil Nadri; B-A. Clayton Tu; Florian Herrault; Hasan Sharifi; Jamin McCue; Abdullah Khan; David Schwan; David Botticello; Sanjana Das; Daniel Kuzmenko; Joel Wong; Vu Phan; Jason Nguyen; Courtney Wilt

出版日期：2023-5-

DOI号：10.1109/ectc51909.2023.00110

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10195363

文献链接：https://doi.org/10.1109/ectc51909.2023.00110

当前文献来源于 IEEE。

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[IEEE] Process Design Kit and Initial Demonstration of Digital Metal-Embedded Chip Assembly for High Density IO Fan-Out Packaging

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