Advancements in Package-on-Package (PoP) technology, delivering performance, form factor &amp; cost benefits in next generation Smartphone processors

发表于 2026-9-7 11:23:45

期刊：2013 IEEE 63rd Electronic Components and Technology Conference

文献作者：Hamid Eslampour; Mukul Joshi; SeongWon Park; HanGil Shin; JaeHan Chung

出版日期：2013-5-

DOI号：10.1109/ectc.2013.6575824

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=6575824

文献链接：https://doi.org/10.1109/ectc.2013.6575824

当前文献来源于 IEEE。

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[IEEE] Advancements in Package-on-Package (PoP) technology, delivering performance, form factor & cost benefits in next generation Smartphone processors