[Springer] Rapid Cu–Cu bonding by pressure-sintering of anti-oxidized Cu nanoparticle pastes under ambient atmosphere | Journal of Materials Science: Materials in Electronics | Springer Nature Link |
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Study on force reduction mechanism in ultrasonic-assisted grinding based on single-grain scratching
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Molecular characterization and functional analysis of a specific secreted protein from highly virulent defoliating Verticillium dahliae
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TiO2@SiO2 flexible nanofiber membrane-based syringe membrane solid phase extraction for determination of beryllium in Chinese yellow rice wine samples by graphite furnace atomic absorption spectrometry
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A conceptual model of organo-mineral interactions in soils: self-assembly of organic molecular fragments into zonal structures on mineral surfaces
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Comparison of T1w, T2w, and T1w/T2w MRI methods for perivascular space quantification
