Microstructural evolution, residual stress, and mechanical property heterogeneity of high-aspect-ratio TGV copper interconnects fabricated by laser-assisted wet etching

发表于 2026-9-16 10:09:03

期刊：Journal of Alloys and Compounds

文献作者：Miao Wang; Jihua Zhang; Wenlei Li; Libin Gao; Hongwei Chen; Mengru Li; Mingcheng Chen; Xiaoshen Han; Dongbin Wang; Shuang Li; Ting Liu; Xue Wen; Xingzhou Cai; Yong Li; Bin Peng; Wanli Zhang

出版日期：2026-8-

DOI号：10.1016/j.jallcom.2026.189908

下载链接：https://www.sciencedirect.com/sc ... 925838826039770/pdf

文献链接：https://doi.org/10.1016/j.jallcom.2026.189908

当前文献来源于 Elsevier BV。

备注信息：

发表于 2026-9-16 10:09:04

: 当前求助已完成，请重新发起求助。
已完结状态的附件将会在24小时内删除。

[Elsevier/Sciencedirect] Microstructural evolution, residual stress, and mechanical property heterogeneity of high-aspect-ratio TGV copper interconnects fabricated by laser-assisted wet etching

已采纳

同分类求助

最新回复

站点公告

今日热心研友

（热心研友QQ群）

[Elsevier/Sciencedirect] Microstructural evolution, residual stress, and mechanical property heterogeneity of high-aspect-ratio TGV copper interconnects fabricated by laser-assisted wet etching 一键复制