System-Level Thermal Analysis of Two-Phase Direct-to-Chip Cooling for Data Centers With Chilled Facility Water

发表于 2026-9-21 18:17:08

期刊：Journal of Electronic Packaging

文献作者：Qingyang Wang; Serdar Ozguc; Richard W. Bonner

出版日期：2026-12-1

DOI号：10.1115/1.4072065

下载链接：https://asmedigitalcollection.as ... 5553/ep-26-1031.pdf

文献链接：https://doi.org/10.1115/1.4072065

当前文献来源于 ASME International。

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