Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits

发表于 2026-9-22 15:20:46

期刊：ACS Applied Materials & Interfaces

文献作者：Tianzhuo Zhan; Keita Sahara; Haruki Takeuchi; Ryo Yokogawa; Kaito Oda; Zhicheng Jin; Shikang Deng; Motohiro Tomita; Yen-Ju Wu; Yibin Xu; Takeo Matsuki; Haidong Wang; Mengjie Song; Sujun Guan; Atsushi Ogura; Takanobu Watanabe

出版日期：2022-2-9

DOI号：10.1021/acsami.1c20366

下载链接：https://pubs.acs.org/doi/pdf/10.1021/acsami.1c20366

文献链接：https://doi.org/10.1021/acsami.1c20366

当前文献来源于 American Chemical Society (ACS)。

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[ACS] Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits

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