Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

发表于 2026-9-28 00:15:51

期刊：IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

文献作者：Zao Liu; Sahana Swarup; Sheldon X.-D Tan; Hai-Bao Chen; Hai Wang

出版日期：2014-10-

DOI号：10.1109/tcad.2014.2334321

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=6899767

文献链接：https://doi.org/10.1109/tcad.2014.2334321

当前文献来源于 Institute of Electrical and Electronics Engineers (IEEE)。

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[IEEE] Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

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