Resiliency of Liquid-to-Liquid Cooling Systems in Data Centers Under Failure Scenarios

发表于 7 天前

期刊：IEEE Transactions on Components, Packaging and Manufacturing Technology

文献作者：Himanshu Modi; Ali Heydari; Pardeep Shahi; Lochan Sai Reddy Chintaparthy; Anto Barigala; Mohammad Raisul Islam; Dereje Agonafer; Mohammad Tradat; Saket Karajgikar; Jeremy Rodriguez

出版日期：2026-7-

DOI号：10.1109/tcpmt.2026.3704055

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=11568834

文献链接：https://doi.org/10.1109/tcpmt.2026.3704055

当前文献来源于 Institute of Electrical and Electronics Engineers (IEEE)。

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