Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density

发表于 7 天前

期刊：2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

文献作者：Euichul Chung; Geyu Yan; Bharath Ramakrishnan; Husam Alissa; Vaidehi Oruganti; Christian Belady; Erik W. Masselink; Muhannad S. Bakir

出版日期：2024-5-28

DOI号：10.1109/ectc51529.2024.00240

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10564954

文献链接：https://doi.org/10.1109/ectc51529.2024.00240

当前文献来源于 IEEE。

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[IEEE] Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density

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