Simulation Studies of Hygro-Thermal-Vapor Induced Stresses and Interface Delamination in High Bandwidth Memory (HBM) Package With Different Numbers of Stacked Chips During Reflow Process

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期刊：2024 25th International Conference on Electronic Packaging Technology (ICEPT)

文献作者：Jiawei Deng; Long Zheng; Mingsheng Luo; Guangchao Lyu; Can Zhao; Xinping Zhang

出版日期：2024-8-7

DOI号：10.1109/icept63120.2024.10668584

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10668584

文献链接：https://doi.org/10.1109/icept63120.2024.10668584

当前文献来源于 IEEE。

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[IEEE] Simulation Studies of Hygro-Thermal-Vapor Induced Stresses and Interface Delamination in High Bandwidth Memory (HBM) Package With Different Numbers of Stacked Chips During Reflow Process