A Novel Through-Glass via (TGV) Inspection Method by Laser Diffraction Analysis

发表于 2026-11-6 17:06:28

期刊：Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability

文献作者：Kuan Lu; Pengfei Lin; Hyunjae Lee; Chabum Lee

出版日期：2026-6-14

DOI号：10.1115/msec2026-182953

下载链接：https://asmedigitalcollection.as ... msec2026-182953.pdf

文献链接：https://doi.org/10.1115/msec2026-182953

当前文献来源于 American Society of Mechanical Engineers。

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