Signal Integrity of Die-to-Die Interface with Advanced Packages for Co-Packaged Optics

发表于 2026-7-9 11:18:52

期刊：2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

文献作者：Jongchul Shin; Hamid Eslampour; Sangnam Jeong; Woopoung Kim; Seokbeom Yong; Sung-Oh Ahn; Eunkyeong Park; Sangsub Song

出版日期：2024-10-6

DOI号：10.1109/epeps61853.2024.10753887

下载链接：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10753887

文献链接：https://doi.org/10.1109/epeps61853.2024.10753887

当前文献来源于 IEEE。

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[IEEE] Signal Integrity of Die-to-Die Interface with Advanced Packages for Co-Packaged Optics

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