The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics

发表于 2026-9-21 17:51:53

期刊：IEEE Transactions on Components, Packaging and Manufacturing Technology

文献作者：Avram Bar-Cohen; Mehdi Asheghi; Timothy J. Chainer; Suresh V. Garimella; Kenneth Goodson; Catherine Gorle; Raphael Mandel; Joseph J. Maurer; Michael Ohadi; James W. Palko; Pritish R. Parida; Yoav Peles; Joel L. Plawsky; Mark D. Schultz; Justin A. Weibel; Yogendra Joshi

出版日期：2021-10-

DOI号：10.1109/tcpmt.2021.3111114

下载链接：https://ieeexplore.ieee.org/ielam/5503870/9592341/9536673-aam.pdf

文献链接：https://doi.org/10.1109/tcpmt.2021.3111114

当前文献来源于 Institute of Electrical and Electronics Engineers (IEEE)。

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