Development of novel multi-selective slurry with mechanically driven etching for through silicon via chemical mechanical polishing

发表于 2026-10-1 19:36:18

期刊：Materials Science in Semiconductor Processing

文献作者：Eungchul Kim; Sanghwan Choi; Sanghuck Jeon; Hyunho Seok; Jin-ill Cho; Dongjoo Shin; Taesung Kim

出版日期：2022-12-

DOI号：10.1016/j.mssp.2022.107025

下载链接：https://www.sciencedirect.com/sc ... 369800122005546/pdf

文献链接：https://doi.org/10.1016/j.mssp.2022.107025

当前文献来源于 Elsevier BV。

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[Elsevier/Sciencedirect] Development of novel multi-selective slurry with mechanically driven etching for through silicon via chemical mechanical polishing

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